Model:TP-S007-00E70662-A
Display size:19 inch
Product mix:Glass G+G
Interface:USB
Width to height ratio:16:9
Operation temperature(℃): -10~+60℃
Storage temperature(℃): -20~+70℃
Out line(mm):1152.51*373.23*2.95
Display area(mm):411.10*231.5
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Anti blackening the screen content can be clearly seen from any angle.
"3A" processing Simultaneously equipped with AG+AR+AF processing.
Low-power consumption Extremely low power consumption, the lowest in the industry.
High sensitivity Fast scanning and refresh rate, startup below 30MS, excellent accuracy and linearity.
Anti-noise Hardware and firmware can be matched to meet strict EMI/RFI standards.
Optical binding After full bonding, the screen's seismic resistance is increased, reducing the chance of damage.
01
COG/Fully automatic binding process This process is mainly to bind the IC and FPC to the LCD panel until the FOG is formed.
02
LCM-Fully automatic film process In this process, FOG and BLD are bonded until LCM is formed.
03
Post film process This process is mainly to attach the auxiliary materials to the formed LCM.
04
LCM electrical burning test This process is mainly to test the performance of the formed LCM.
05
TLCM/Automatic film process This process is mainly to bond LCM and TP until TLCM state.
06
Defoaming furnace process This process is mainly to defoam the laminated TLCM.
07
FQCinspection area This process is mainly to carry out the final process test of the laminated TLCM finished product.
08
Outgoing quality control This process is mainly for TLCM finished product quality inspection before shipment.